Foxconn has reportedly secured orders to manufacture computing trays for Google’s TPU AI clusters. This move by a top NVIDIA supply chain partner highlights the growing competition in AI accelerators. It shows Big Tech’s custom silicon is gaining real traction.
Intel is turning to Amkor to help manufacture its EMIB advanced packaging technology. This move comes as demand for alternatives to TSMC’s overbooked CoWoS packaging explodes from AI chip designers.
In a surprising internal conflict, Samsung’s chip-making division has reportedly rejected a request for a year’s supply of DRAM from its own smartphone unit. The move, driven by soaring memory prices, could lead to price hikes for future Galaxy phones like the S26.
Apple’s A20 and A20 Pro chips represent the company’s first move to 2nm technology, bringing significant architectural changes beyond just the node shrink. The switch to WMCM packaging and cache improvements could deliver real-world performance gains that matter to users. Here’s what to actually exp
Chinese GPU maker Moore Threads is heading for a massive $1.1 billion IPO in Shanghai, drawing over 4,000 retail investor subscriptions. While Western media calls it the “NVIDIA of China,” the company’s gaming GPUs still trail years behind current technology. The real question is whether the IPO hyp
Intel is reportedly developing a massive 144MB bLLC cache for its 2026 Nova Lake-S processors. This technology directly targets AMD’s 3D V-Cache advantage in gaming performance. The feature will likely be exclusive to unlocked Core Ultra 400K series chips.
TSMC’s Fab 21 in Phoenix had to scrap thousands of wafers after a power outage at industrial gas supplier Linde forced a shutdown. The incident reveals vulnerabilities in TSMC’s US supply chain compared to its tightly controlled Taiwan operations. Customers include Apple, Nvidia, AMD, and Tesla.
ARM’s $140 billion valuation assumes the company will magically triple revenue and double margins. But with smartphone growth tapped out and RISC-V competition rising, this AI hype looks dangerously overblown.
TSMC has officially sued former senior vice president Wei-Jen Lo for joining Intel, claiming he had access to confidential 2nm process technology. The lawsuit alleges potential trade secret violations and breach of employment contracts.
Intel engineers are working on Dynamic PAMT to address memory efficiency issues in their TDX security technology. The current implementation consumes approximately 0.4% of system memory regardless of actual usage. This optimization could significantly improve resource utilization in enterprise envir
