Flex (NASDAQ: FLEX) has launched the industry’s first globally manufactured AI infrastructure platform that integrates power, cooling, compute, and services into modular designs, enabling data center operators to deploy infrastructure up to 30 percent faster while addressing the unprecedented scaling demands of artificial intelligence workloads. This breakthrough platform represents a significant evolution in data center infrastructure design, combining Flex’s vertically integrated manufacturing capabilities with pre-engineered reference architectures specifically optimized for next-generation AI and high-performance computing environments.
Integrated Platform Accelerates AI Deployment
The new platform unites essential building blocks of AI-scale infrastructure through pre-engineered, modular designs that dramatically reduce complexity compared to traditional bespoke approaches. “As AI adoption accelerates, data center operators must overcome rising power, heat, and scale challenges to deploy infrastructure at unprecedented speed,” said Michael Hartung, president and chief commercial officer at Flex. The company’s open architecture provides the flexibility required for faster, more predictable deployments, enabling operators to keep pace with explosive artificial intelligence demand while accelerating revenue recognition through significantly reduced time-to-market.
Key Advantages of Flex’s Modular Approach
Flex’s platform delivers several critical advantages that address the most pressing challenges in modern data center operations. The integrated solution represents what industry experts note is the deepest hardware stack in the industry, combining compute with critical infrastructure for higher performance and efficiency. Key benefits include:
- Faster deployment: Up to 30% faster time-to-market through pre-engineered modular designs
- Integration as innovation: Unified platform enabling rack, cooling, and power breakthroughs
- Flexible, open architecture: Adaptable to customer-preferred OEMs and partner-friendly implementation
- Lifecycle intelligence: Built-in monitoring, predictive analytics, and system-level optimization
The platform’s modularity enables rapid scaling while maintaining consistent performance standards, a critical consideration given the infrastructure demands highlighted in additional coverage of recent service disruptions affecting digital infrastructure.
Breakthrough Products Addressing Power and Cooling Challenges
The platform debuts with several innovative Flex products specifically designed to tackle the rising power, heat, and scale challenges of AI workloads. These include 1MW racks featuring high-density, liquid-cooled IT racks and OCP-inspired power racks designed to support +/-400V and enable the transition to 800VDC power architectures. The solution also introduces the market’s first UL 1973-certified capacitive energy storage system, reducing electrical disturbances from AI workloads, and a modular rack-level coolant distribution unit delivering up to 1.8MW of flexible capacity.
These innovations in power and cooling infrastructure represent significant advancements in 19-inch rack technology, enabling higher density deployments while maintaining operational reliability. The importance of robust infrastructure is further emphasized by related analysis examining data security and system reliability in telecommunications networks.
Global Manufacturing and Support Capabilities
As a company listed on Nasdaq, Flex leverages its global manufacturing footprint to deliver consistent quality and supply chain resilience for data center operators worldwide. The vertically integrated manufacturing approach enables scale production of the complete infrastructure stack while maintaining rigorous quality standards. This global capability is complemented by comprehensive support services and warranty coverage, ensuring operators can deploy with confidence even as they accelerate their infrastructure timelines.
The platform will be highlighted during the OCP Global Summit in booth B24, where Flex will demonstrate how its integrated approach enables faster, more reliable deployment of AI-scale infrastructure while addressing the critical challenges of power density, thermal management, and rapid scaling that have become defining characteristics of the modern AI era.
